(EMAILWIRE.COM, November 19, 2000 ) Taiyo Yuden Co. Ltd. Friday introduced its new line of Bluetooth components with production and distribution of three digital short-range RF modules for wireless communication between portable consumer devices, its North American subsidiary, Taiyo Yuden (U.S.A.), Inc., announced.

Combining its expertise in multilayered component manufacturing, high-frequency circuitry design, advanced assembly techniques and evaluation standards with aggressive Bluetooth research and development and strategic partnerships, Taiyo Yuden cements its leadership position in this rapidly emerging market with these product releases.

The RF modules will be introduced at Comdex/Fall 2000, Nov. 13-17, in Las Vegas, and will be on display at both Taiyo Yuden booths, L7835 and BT09 (Bluetooth Pavilion). The products include: a 15.1 x 13.9 x 2.2mm 0dBm power RF module for cell phone applications; a 33.7 x 16 x 2.2mm 0dBm device for PDA and handheld computing devices; and a 32 x 19.5 x 2.2mm 20dBm for notebook and portable PC applications. All three comply with Bluetooth specification version 1.0b, operate in the 2.4GHz band, and support both voice and data communications. The PDA and PC modules incorporate a radio and baseband core with built-in flash memory as well as USB high-speed and UART interfaces for communication capability with the "master" device.

"Taiyo Yuden has taken advantage of its strengths and experience in high-frequency component technology and module design to put the company at the forefront of Bluetooth module development," Mr. Sekiguchi, a Taiyo Yuden Bluetooth project leader, stated. "The modules are optimized for notebook and handheld applications, but may be employed in any device that uses Bluetooth technology."

The Taiyo Yuden modules are built around an advanced chipset utilizing silicon-on-Insulator (SOI) BiCMOS process technology, which requires less than half the power of CMOS-based chips. Production costs are reduced by a baseband-to-RF signal direct conversion system, eliminating the need for SAW filters and LC passive filters, and resulting in modules that offer performance, size and cost benefits to OEM designers.

Price: Consult factory

Availability: Samples in November; mass production March 2001

Now in its 50th year, Tokyo-based Taiyo Yuden Co. Ltd. is a worldwide manufacturer of surface mount and leaded passive components, power electronics modules and power supplies. With approximately 50% of the worldwide market in high-frequency multilayer chip inductors used in cellular phone applications, Taiyo Yuden reports annual sales of nearly US$2B. Worldwide, Taiyo Yuden employs more than 14,000 people, and the company's North American affiliate, Taiyo Yuden (U.S.A.), Inc., operates sales and engineering offices in Chicago, San Jose and San Diego County.

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Produced for Taiyo Yuden Co. Ltd.

Contacts:

Taiyo Yuden (U.S.A.) Inc.
Mike Tanahashi, Strategic Planning Manager
408/573-4150
Fax: 408/573-4159
mtanahashi@t-yuden.com
http://www.t-yuden.com

WelComm Inc.
Mike Gerow, PR Director, 858/279-2100
Fax: 858/279-5400
mike@welcomm.com

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Contact Information:
Taiyo Yuden (U.S.A.) Inc.
Joseph Nchor
Tel:
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