HelpHelp About Us Contact Contact Us Help Help
Press Release Service
user name password
Client login:   
First time user sign up Forgot your login info?
Website Directory     Submit Website

Search
EmailWire News Links

Home > News By Company > Applied Materials, Inc.

Print e mail rss del Y! myWeb Tweet
 

Applied Materials Unveils Major New Technology Center to Enable Future Chip Manufacturing

State-of-the-Art Development Facility Helps Customers Bring New Chip Technologies to Market Faste

(EMAILWIRE.COM, March 21, 2002 ) Applied Materials, Inc. is leading the way to a new era in chipmaking with the announcement of its Process Module Technology Center, the equipment industry's most advanced facility for semiconductor process technology development. The state-of-the-art facility, equipped with a full complement of process, yield enhancement and automation technologies, can greatly speed customers' development and introduction of future faster, more powerful, sub-100-nanometer copper-based chips.

"This new world-class facility reflects Applied Materials' strong commitment to pioneer cutting-edge semiconductor manufacturing solutions with our customers," said Dr. Dan Maydan, president of Applied Materials. "In the extremely competitive semiconductor market, our customers will need to rapidly reach volume production and high yield to meet critical market windows for their next-generation chips. Closely simulating customers' fab environments, this facility allows us to better understand their challenges and work hand-in-hand to provide the most effective and optimized solutions possible."

The new center is Applied Materials' second dedicated technology development facility in Silicon Valley and further extends the success of its Equipment Process Integration Center (EPIC) that opened in November 1998. Located in Sunnyvale, California, the new 166,000 square foot facility features 39,000 square feet of clean room space with ISO Class 3 air handling and capacity to house over 300 individual pieces of process and support tools, making it the largest process facility operated by an equipment supplier. Combined, these facilities represent the greatest concentration of process integration experience and investments in future technology ever made by an equipment supplier, providing unmatched support for customers as they make the critical transitions to the nanochip era and beyond.

The combined facilities incorporate Applied Materials' latest 100nm and below generation process and inspection technologies for transistor and copper interconnect fabrication to enable the world's highest performance chip designs. The exceptional complexity of 100nm generation chips has led Applied Materials to develop a new business model for the semiconductor equipment industry with its Process Module( approach. Both facilities are dedicated to this concept of integrating multiple individual systems to function as single highly automated units, reducing the need for customers to perform costly and time consuming process integration themselves.

Applied Materials' investment in the new facility includes the most advanced DUV photolithography support available, including both 248nm and 193nm wavelength 300mm wafer patterning capability. Complete analytical and testing capability is available for electrical and reliability verification of device performance. Combined with world-class metrology and inspection systems for optimized wafer processing quality and yield, the center is an exceptional resource for next generation device production.

As a fully equipped facility, the new center provides Applied Materials with extensive construction, equipment installation and maintenance experience that strengthen its capability to support customers with new Total Service Solution programs such as RPM (Ramp Performance Management(tm)). The RPM is the equipment industry's first turnkey service for installing process equipment in customers' new and existing fabs.

"Applied Materials has continuously invested to deliver new technologies and services that provide our customers with strategic cost, yield, quality and productivity advantages," said Maydan. "At our two facilities, customers will be able to work side by side with Applied Materials technologists to develop and qualify next generation chips and manufacturing processes, working on critical challenges such as low and high ??dielectrics, copper interconnects and smaller, faster transistor designs."

Applied Materials (Nasdaq: AMAT), the largest supplier of products and services to the global semiconductor industry, is one of the world's leading information infrastructure providers. Applied Materials enables Information for Everyone(tm) by helping semiconductor manufacturers produce more powerful, portable and affordable chips. Applied Materials' Web site is www.appliedmaterials.com

---------------

Produced for Applied Materials

Contacts:

Connie Duncan
Technical Media
(408) 563-6209

Jeff Lettes
Business/Financial Media
(408) 563-5161

Carolyn Schwartz
Financial Community
(408) 748-5227

---------------

Contact Information:
Applied Materials, Inc.
Joseph Nchor
Tel:
Email us


This is a press release. Press release distribution and press release services by EmailWire.Com: http://www.emailwire.com/us-press-release-distribution.php.
Press Release Keywords:

State-of-the-Art Development Facility Helps Customers Bring New Chip Technologies to Market Faste

Private Equity, Angel Investing
Equity Alliance / Private Equity, Angel Investing, / IPO, Venture Capital & IR services / Equity Alliance International

Equityallianceir.com





Penny Stocks to Watch

Sign up for hot penny stock picks
Gains of 500%+ possible!

Premiumstockpicks.com/landing/




Satellite TV for PC

Watch Streaming Tv Right on Your PC

Satellitetelevisionforpc.com



 



Your text Ads & 

PR

Text Ads plus unlimited press releases, One release featured/Day for only $575 per month.

Read more on Text Ads & PR






Your text Ads Here!

Text Ads are only $289 per month. Ads are placed same day.

More on Text Ads Advertising



 

Search


Advertising | How to contact us | Privacy Statement | EmailWire Press Releases | Partnership Opportunities

EmailWire is a press release distribution service of GroupWeb Media LLC.

© Copyright GroupWeb Media LLC 2012