(EMAILWIRE.COM, May 23, 2001 ) Applied Materials, Inc. today announced a new addition to its Ultima HDP-CVD* product family that targets next-generation gap-fill for advanced STI*, IMD* and PMD* applications. The new Ultima X(TM) system is the first HDP-CVD solution to support sub-100nm device geometries, enabling the production of future logic, Flash and DRAM devices. ( *Acronyms spelled out at end of text) "This dramatic advancement to our market-leading Ultima HDP-CVD system is designed to rapidly take customers to their next generation of high-performance devices by meeting sub-100-nanometer technology node requirements," said Dr. Farhad Moghadam, vice president and general manager of Applied Materials' Dielectric Systems and Modules Product Group. "The Ultima X system's capability to extend HDP-CVD for several device generations on a proven platform meets our customers' most aggressive technology needs while lowering their risks and capital investments." The Ultima X system incorporates several new technology advances that provide uniform, void-free deposition for both 200mm and 300mm wafers. The chamber's advanced gap-fill technology is at the heart of the system, supporting the breakthrough "center-to-edge" fill capability for void-free deposition across the entire wafer. This unique feature enables the Ultima X system to extend HDP-CVD gap-fill down to 70nm with aspect ratios of greater than 7:1. The capability to provide improved fill at the wafer's edge allows customers to maximize use of the entire wafer surface area for increased yield. Three key features, the Ultima X system's enhanced FOCUS(TM) (fully optimized coil for uniform sputtering) source design, high source RF power and larger pumps, deliver the superior gap-fill results required at the sub-100nm technology node. New advanced temperature control features that minimize film defects and particulates also lead to improved yield. Featuring Applied Materials' high-efficiency, top-mount Remote Clean(TM) plasma source and high-speed cVHP robot, the Ultima X system carries forward the throughput and productivity benefits of the Ultima product line. The Remote Clean reduces chamber clean time and NF3 consumption by more than 40 percent, enabling an increase in system throughput of up to a 10 percent and lower gas cost. Since its introduction in 1996, the Ultima platform has set the industry standard for HDP-CVD applications by pioneering the volume production of first-generation FSG (fluorinated silicate glass) low k films and now by providing the gap-fill technology required for the production of future DRAM devices. Currently used by 17 of the top 20 semiconductor manufacturers worldwide, the Ultima platform is the industry's leading HDP-CVD product family. According to VLSI Research, Applied Materials was ranked the number one supplier of HDP-CVD equipment for 1998 through 2000. VLSI Research estimates the market for HDP-CVD equipment reached $1.3 billion in 2000 and will grow to $3.2 billion by 2005, representing a compound annual growth rate of 20.5 percent over the next 5 years. Applied Materials (Nasdaq: AMAT), the largest supplier of products and services to the global semiconductor industry, is one of the world's leading information infrastructure providers. Applied Materials' Web site is http://www.appliedmaterials.com.*HDP-CVD: high-density plasma-chemical vapor depositionSTI: shallow trench isolation IMD: inter-metal dielectric PMD: pre-metal dielectric --------------- Produced for Applied Materials Contact:Connie Duncan(editorial/media)(408) 563-6209Carolyn Schwartz(financial community)(408) 748-5227---------------

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